HSP and Slovakia Sign
MoU to Bolster Cooperation
Taiwan has been proactive to strengthen
ties with Central and Eastern European countries in recent years. In October
2021, the Hsinchu Science Park Bureau (HSPB) was part of a government
delegation to Slovakia, the Czech Republic, and Lithuania. While it is
aggressively promoting the semiconductor industry, Slovakia understandably
seeks to work more closely with the Hsinchu Science Park, a world-famous hub on
this front. With Minister of Science and Technology Wu Tsung-tsong as witness,
HSPB Director-General Wayne Wang and Filip Pastorek, director of the University
of Zilina’s Research Center, signed a memorandum of understanding on October 22
as the first step toward bilateral cooperation.
At the invitation of officials with
Slovakia’s Ministry of Economy, a video conference was held on November 8 for
the two sides to share experiences in developing science parks and the
technology industry. On the occasion, Slovakia expressed great interest in
Taiwan’s development of science parks—establishment conditions, infrastructure,
management, and introduction of tenant companies—and promotion of startups. By
learning more about such workings in Taiwan, the country wishes to better
foster its own industrial innovation and economic development.
The latest video conference proved fruitful
and drew to a successful close. Both parties expressed hope that more such
virtual exchanges would follow and agreed to further promote bilateral
cooperation through physical visits and information sharing going forward.